Dicing × Career Path: Leader
3 jobs found.
Silicon Wafer Cutting Worker
This occupation handles the manufacturing process of accurately cutting silicon wafers into individual chips using dicing equipment. It involves equipment setup and management, verification of cutting accuracy, and quality inspections.
Diamond Die Manufacturer
Manufacturing job that processes and finishes cutting and polishing tools (dies) using diamond particles with precision machinery.
Semiconductor Integrated Circuit (IC) Manufacturing Worker
Responsible for the manufacturing processes of semiconductor integrated circuits (ICs), operating and managing wafer processing, etching, film formation, inspections, etc., in a cleanroom environment. This is an operational job.