Wafer Polishing Worker
うぇーはけんまこう
Industry & Occupation
Classification
Summary
Wafer polishing workers flatten the surface of semiconductor wafers using methods such as chemical mechanical polishing (CMP), supporting high-precision manufacturing processes as manufacturing operators.
Description
Wafer polishing workers are responsible for the critical wafer surface flattening process in semiconductor manufacturing. Using CMP equipment, they remove minute irregularities with chemicals and polishing pads to achieve the specified thickness and flatness. They also adjust process parameters, measure surface roughness, and maintain cleanroom environments, aiming to reduce defect rates and improve yield.
Future Outlook
With the increasing demand for semiconductors, the importance of wafer processing steps is growing, and job openings are stable or increasing. Acquiring automation and high-precision technology skills is key to career advancement.
Personality Traits
Work Style
Cleanroom duty / Contract employee / Dispatched employee / Full-time employee / Shift work
Career Path
Operator → Team Leader → Process Engineer → Manufacturing Management → Quality Assurance
Required Skills
CMP Equipment Operation / Chemical Handling / Compliance with Cleanroom Work Procedures / Process Parameter Adjustment / Surface Roughness Measurement
Recommended Skills
Cleanroom Management / Reading English Technical Documents / Statistical Process Control / Troubleshooting
Aptitudes (Strengths Preferred)
| Item | Description |
|---|---|
| Attention to Detail & Accuracy | High precision is required. |
Aptitudes (Weaknesses Acceptable)
| Item | Description |
|---|---|
| Creativity & Ideation | Mainly routine tasks. |
| Numerical & Quantitative Analysis | Mathematical analysis is not much needed. |
Related Qualifications
- Hazardous Materials Handler (Class B)
Aliases
- Wafer Polishing Worker
Related Jobs
- CMP Engineer
- Semiconductor Manufacturing Operator
- Surface Treatment Technician