Dicing Worker
だいしんぐこう
Industry & Occupation
Classification
Summary
Specialist who precisely cuts semiconductor wafers to chip size using a dicing saw.
Description
Dicing workers are a profession that uses dicing saws in clean rooms to cut semiconductor wafers into individual pieces. They secure the wafer, set cutting conditions, replace and clean blades, inspect chips after cutting, and contribute to yield and quality control. Due to the fine processing involved, management of vibrations and cutting debris is required, and they also handle daily machine inspections and simple maintenance. Work is conducted in teams, and creating work records and providing feedback on defect causes are important tasks.
Future Outlook
Stable demand is expected due to increasing semiconductor needs, but automation and AI control introduction will require more advanced operation skills and process management abilities.
Personality Traits
Work Style
Career Path
Junior Operator → Senior Operator → Process Leader → Process Engineer → Manufacturing Management
Required Skills
Clean Room Work Experience / Dicing Machine Operation / Machine Inspection and Maintenance / Positioning Technology / Quality Inspection
Recommended Skills
English (Manual Reading) / Machine Maintenance Technology / QC Tools / Semiconductor Manufacturing Process Knowledge
Aptitudes (Strengths Preferred)
| Item | Description |
|---|---|
| Attention to Detail & Accuracy | Because fine work precision is required. |
| Physical Stamina & Endurance | Because it involves standing work in a clean room and prolonged concentration. |
Aptitudes (Weaknesses Acceptable)
| Item | Description |
|---|---|
| Creativity & Ideation | Because work procedures are standardized and novelty is low. |
Aliases
- Dicing Operator
Related Jobs
- Bonding Worker
- Semiconductor Etching Worker
- Wafer Inspector
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