Silicon Wafer Cutting Worker
シリコンウェーハせつだんこう
Industry & Occupation
Classification
Summary
This occupation handles the manufacturing process of accurately cutting silicon wafers into individual chips using dicing equipment. It involves equipment setup and management, verification of cutting accuracy, and quality inspections.
Description
Silicon wafer cutting workers operate dicing machines in clean rooms to divide silicon wafers into individual chips. They select blades, set rotation speeds, cutting speeds, etc., to maintain cutting accuracy. After operations, they use microscopes or image inspection devices to check the quality of cut surfaces, and perform equipment adjustments and root cause analysis in case of defects. Regular equipment maintenance and cleaning are also important tasks, supporting stable manufacturing while complying with clean room operation protocols.
Future Outlook
With the expansion of semiconductor demand, the need for skilled silicon wafer cutting workers is increasing. As automation and AI-controlled equipment are introduced, advanced equipment operation and maintenance capabilities are increasingly required.
Personality Traits
High concentration / Meticulous / Strong sense of responsibility
Work Style
Career Path
Team Leader → Process Management Engineer → Manufacturing Technology Engineer → Quality Management Specialist
Required Skills
Clean Room Work Procedures / Dicing Equipment Operation / Equipment Setup Adjustment / Quality Inspection (Microscope Inspection)
Recommended Skills
Anomaly Detection and Root Cause Investigation / Data Recording / Equipment Maintenance
Aptitudes (Strengths Preferred)
| Item | Description |
|---|---|
| Attention to Detail & Accuracy | Because minute cutting accuracy directly impacts product quality. |
Aptitudes (Weaknesses Acceptable)
| Item | Description |
|---|---|
| Creativity & Ideation | Mainly routine work, with little demand for generating new ideas. |
Related Qualifications
- Forklift Operation Skills Training
Aliases
- Dicing Operator
- Wafer Dicer
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