Semiconductor Cutting Worker
はんどうたいせつだんこう
Industry & Occupation
Classification
Summary
Operator on the manufacturing line who divides semiconductor wafers into individual chips using dedicated machines such as dicing saws.
Description
Semiconductor cutting workers handle the task of setting wafers that have completed film formation and etching processes in manufacturing into the dicing saw and dividing them into chips according to designed dimensions. The work is performed in a clean room, including machine program settings, blade replacement, and appearance and dimensional inspection of chips after cutting. They use precision measuring instruments to verify cutting accuracy and exclude chips that do not meet quality standards. Regular machine maintenance and adherence to work procedures are required to maintain stable quality and production efficiency.
Future Outlook
With the growth of the semiconductor market, demand for high-precision cutting technology remains stable, and the introduction of automation and AI-based process management is expected to advance.
Personality Traits
Work Style
Career Path
Semiconductor cutting operator → Production engineering → Quality management → Line leader
Required Skills
Clean room work experience / Dicing saw machine operation / Understanding of work procedures / Use of measuring instruments
Recommended Skills
Basic knowledge of semiconductor processes / Machine maintenance (basic) / Quality control
Aptitudes (Strengths Preferred)
| Item | Description |
|---|---|
| Attention to Detail & Accuracy | Because micron-level precision is required. |
Aptitudes (Weaknesses Acceptable)
| Item | Description |
|---|---|
| Creativity & Ideation | Mainly routine tasks where creativity is not highly required. |
Aliases
- Dicing Operator
- Wafer Cutting Worker
Related Jobs
- Semiconductor Inspection Worker
- Semiconductor Mounting Worker
- Semiconductor Polishing Worker
- Semiconductor Wafer Cleaning Worker