Bonding Operator (Semiconductor Manufacturing)
ぼんでぃんぐこう
Industry & Occupation
Classification
Summary
Manufacturing job that operates wire bonding equipment to electrically connect semiconductor chips and external terminals using tiny metal wires.
Description
Bonding operators use wire bonding and die bonding equipment on semiconductor wafers or chips to precisely position and connect tiny metal wires or chips. In clean rooms, they use microscopes for alignment and adjust temperature and pressure conditions to ensure the product's electrical and mechanical reliability. After operations, they verify connection status through magnified inspections and electrical tests, and also conduct data analysis and improvement proposals to enhance yield rates. Requires advanced precision work skills and quality management abilities.
Future Outlook
High demand continues with the expansion of the semiconductor market. Amid advancing automation and labor reduction, the need for technicians involved in equipment maintenance and process development is expected to increase.
Personality Traits
Good Team Player / High Concentration / Meticulous / Strong Sense of Responsibility
Work Style
Career Path
Operator → Leader (Group Leader) → Production Engineering Engineer → Quality Control → Factory Manager
Required Skills
Clean Room Work / Die Bonding Equipment Operation / Microscope Alignment / Quality Inspection / Wire Bonding Equipment Operation
Recommended Skills
Basic Semiconductor Process Knowledge / English (Technical Document Reading) / Equipment Maintenance / Statistical Quality Control
Aptitudes (Strengths Preferred)
| Item | Description |
|---|---|
| Attention to Detail & Accuracy | Accuracy is essential for precisely aligning and connecting fine parts. |
| Problem Solving | Need to quickly identify and address issues such as connection failures or foreign matter contamination. |
Aliases
- Bonding Operator
- Wire Bonding Technician
Related Jobs
- Die Bonding Operator
- Semiconductor Manufacturing Operator
- Wire Bonding Operator